Multidisciplinary integration is the technological core of CPI-ENG.
We develop intelligent systems where mechanics, electronics, and software operate in perfect synergy to meet complex needs.
We design multilayer PCBs for high and low power applications, selecting COTS components to optimize the cost/performance ratio. We develop firmware for real-time control and DSP algorithms for embedded systems with limited resources.
We create advanced communication architectures for interconnected systems with an Internet of Things (IoT) perspective, as well as for Machine-to-Machine (M2M) data exchange.
We implement HMI interfaces (desktop, web, or embedded) and customized cloud infrastructures for data collection and analysis, integrating Machine Learning models for monitoring and predictive maintenance.
Each mechatronic assembly is subjected to rigorous testing protocols, including thermal tests, work cycle simulations, and accuracy checks on sensors and actuators.